WE! – GRAVOmer-HoluMi-3D

FZ: 03WIR2009

Highly dynamic laser technology for ultra-fast, precise microstructuring of three-dimensional surfaces

Femtosecond lasers (USP lasers) are particularly suitable for the high-precision micromachining of surfaces. Due to the short laser pulses, these are only exposed to low thermal stress, so that material can be removed particularly finely and precisely. The problem with USP laser processing is that, up to now, only low power levels could be implemented and therefore limited processing speeds could be achieved, making it virtually impossible to economically microstructure large surfaces.

The planned R&D project addresses these technological limits and pursues the goal of developing an innovative laser processing system which, through the use of new high-power USP lasers and a new type of polygon scanner, will enable high-precision three-dimensional processing over large areas for the first time and at the same time enable very precise microstructures on three-dimensionally shaped surfaces, e.g. pre-structured embossing rollers, injection molding or forming tools. This technology is intended to enable the economic functionalization of components for the optimization and targeted adaptation of design, friction, appearance and feel, dirt adhesion or cell growth by means of three-dimensional micro- and nanostructures.

ACSYS Lasertechnik GmbH
Federal Ministry of Education and Research
Moewe Optics
Gravomer
Laser Institute Mittweida University of Applied Sciences
us! Change through innovation in the region

Your ACSYS laser expert

Do you have any questions?
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Ardalan Masoumi

Business Development Manager

Telephone: +49 7154 80875 531

E-Mail: a.masoumi@acsys.de

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Consent to processing can be revoked at any time by telephone via +49 7967 152 0 or by e-mail info@acsys.de. The data you provide will be processed by ACSYS Lasertechnik GmbH for the purpose of processing your request. The data will not be passed on to third parties. Further information can be found in the privacy policy.