Laser, pioneering spirit & creativity

We have your future in mind. Together with leading laser institutes, we are researching innovative solutions for laser processing in order to give companies from various industries a competitive edge.

Solutions & applications

ACSYS is committed to continuous research and development to improve technologies and redefine the boundaries of laser material processing. Our versatile teams develop innovative hardware and software solutions for the future of laser technology. Here are some of the groundbreaking advances we have made in laser processing together with our partners:

Further innovations and patents

Our thirst for knowledge and pioneering spirit spur us on to top performance in the area of R&D. And ultimately for your solution. This has made us a technological pioneer in the field of laser micromachining since 2003.

We have your future in mind

Together with leading laser institutes, we are researching innovative solutions for laser processing in order to give companies from different sectors a competitive edge.

Pulse Forging®

Making surfaces clean, smooth and shiny – similar to polishing, only with laser technology.

Pulse Forging® is a process that smoothes the surface of a material and makes it shiny, similar to polishing. The process works by using a femtosecond laser to generate so-called phantom pulses with an extremely high repetition rate, which expand the plasma of the laser again. This expanding plasma generates shock waves that forge the material, similar to millions of small hammers working on the surface of the material. The process improves the surface quality, reduces surface roughness and creates a silvery sheen on the surface. The special Pulse Forging® technology from ACSYS smoothes the smallest structures with a surface roughness of SA 0.1 μm.

Ultra Short Pulse Lasers (USPL) or femtosecond lasers from ACSYS combine two quality-critical processes: high-precision 3D engraving and surface polishing. The special capabilities of this patented process significantly shorten the production time of a minting die, for example. Pulse Forging® works gently. Its laser pulses do not remove material, but compact it. The material structure and properties, such as the degree of hardness, are retained. All in all, Pulse Forging® technology from ACSYS offers measurable advantages, such as

  • Smooth and glossy surfaces
  • Laser-typical precision for engraving and polishing
  • Extreme repeatability through automation
  • High efficiency and time savings

Large Field Removal (LFR)

Large-scale seamless laser processing of 3D geometries up to 1,250 mm × 1,250 mm.

Imagine being able to process 3D components with a surface area of up to 1,250 mm × 1,250 mm in one piece with a laser and thus break new ground in terms of product design. This is exactly what our highly developed Large Field Removal offers you. The LFR® technology from ACSYS can be combined with various laser sources and is always suitable where large working areas are required. The entire area can be processed without axis movement. This gives you new freedom in the design of products, components and design elements that meet the highest standards of appearance and quality. Thanks to continuous laser processing, the spot size of the laser remains precise and there is no visible build-up or overlapping during processing.

Experience innovations up close.

For example, during a visit to our technical centers in Mittweida and Kornwestheim.

Do you have questions?

We are happy to help you.

Contact

Contact us

Consent to processing can be revoked at any time by telephone via +49 7967 152 0 or by e-mail info@acsys.de. The data you provide will be processed by ACSYS Lasertechnik GmbH for the purpose of processing your request. The data will not be passed on to third parties.

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Consent to processing can be revoked at any time by telephone via +49 7967 152 0 or by e-mail info@acsys.de. The data you provide will be processed by ACSYS Lasertechnik GmbH for the purpose of processing your request. The data will not be passed on to third parties.