Insights
Our long-standing expertise and our thirst for knowledge in laser engraving, laser marking, laser structuring, laser welding and laser cutting are reflected in many small details as well as in innovations and patents. Get to know our unique solutions in the areas of software, hardware, automation and processes. Find out how they help you to achieve high-quality and efficient results in your daily practice.
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Laser ablation: material removal with laser technology
Laser ablation refers to the removal of material with the help of ultra-short pulsed laser radiation. The process is suitable for high-precision structuring and texturing of surfaces.
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Femtosecond Laser (USPL): A new dimension in precision machining
Femtosecond lasers open up a new dimension in precision machining. The ultra-short pulses allow the finest structures to be created on almost any material without causing significant thermal damage.
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Accuracy classes and their special features
Different applications require specific levels of precision, which we at ACSYS meet with three accuracy classes for optimum cost-benefit ratios.
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Large field removal: paint removal on large and complex components
Seamless laser processing of components with an area of up to 1,250 mm × 1,250 mm in one piece with the highly developed Large Field Removal technology.
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Dual laser / double laser / duo laser
Multi-head or multi-laser solutions are ideal where workpieces have to be processed from several sides in a single operation and cycle times play a role.
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